Intelligence-Micron produced Nand Flash Sub- 40nm

Saint Clara - Corporation Intelligence and Micron Technology Inc. introduced process technology of the industry sub-40 (smaller than 40 nanometer) for NAND memory, through 34nm 32 gigabit (GB) the multi-level cell chip. The process tekonologi this was developed together by Intelligence and Micron, and was produced by the NAND joint venture flash, IM Flash Technologies (IMFT). This project was claimed as the NAND process with the smallest measurement in the market. 32Gb NAND chip digadang-gadang as the single component smallest with the density that could dimasukan in the measurement standarisasi 48-lead thin small-outline package (TSOP) His capacity could it was promised give cost saving with the density of the data that was higher in pengaplikasian available. The sending sample for the customer was begun in June, and the mass production was hoped for in around the beak the two years. \the new Component 32Gb this gave bit the density of the highest storage available for the industry ini,\said Brian Shirley, the Vice President of Micron Memory Group in his release. Chip 34nm 32Gb will be produced in wafer 300 millimetre, that respectively will produce approximately 16 terabyte NAND. with the measurement measuring 172 square millimetre, not more than the measurement of the thumb nail. One chip 32Gb could keep the data more than 2,000 digital photographs high-resolution or kept up to 1,000 songs in pemutar personal music. The package 8-die stacked (built up) dual will bring about the storage capacity 64 gigabytes (GB), was enough to record the video high-definition from eight to 40 hours in digital camcorder.Chip 34nm 32Gb was indeed drafted to solid-state drive. This product will enable SSD that was more frugal the cost, instantly doubled the volume of the storage of this equipment and triggered the capacity to more than 256 GB from the standard now, to small measurement equipment 1.8 inch. Was based on architecture 34nm, Intel and Micron also planned to introduce the multi-level product cell for the lower density, including the product single-level cell at the end this year.